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The common method used to deposit thin-film materials; material to be deposited is heated in a vacuum (10-6, 10-7 Torr range) until it melts and starts evaporating; this vapor condenses on a cooler substrate inside the evaporation chamber forming very smooth and uniform thin films; not suitable for high melting point materials; PVD method of thin film formation.

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Secteur d’activité/Domaine : Semiconducteurs
Catégorie : Gaufrette de silicium
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