испаравање

испаравање

One of the final steps in processing a wafer during which conductive metal, usually aluminum, is deposited on the surface of the wafer in order to provide electrical interconnection of the various active elements on each die. Metallization may also be accomplished through sputtering.

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Secteur d’activité/Domaine : Semiconducteurs
Catégorie : Qualité de semiconducteur
Company: National Semiconductor
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